HISS300E Evaporation System for Metals & Metal oxides
- Inline system für corrosion protection coatings
- Entry / exit load lock chambers, 2 process chambers
- Pre-treatment by sputter etching, evaporation
- Substrate dimensions 300 x 300 mm2
APPlication
- Jet and electron beam (EB) evaporation of metals and metal oxides to form corrosion protective layers;
- High-productivity processing of steel sheets on a carrier in substrate face-down mode, maximum substrate size 300 x 300 mm2; film thickness non-uniformity ≤ 5%
- R&D, pilot production
Technology
Substrate Pre-treatment
- HF sputter etching
- Stationary heating
Deposition
- JET evaporation, Mg deposition rate ≥ 8 µm/min and EB evaporation, Al deposition rate ≥ 10 µm/min;
- Stationary heating, single evaporation and co-evaporation processing mode
- Run-in stabilizing of the evaporation rate by shutters
- Base pressure ≤ 1 ⋅10-5 mbar
Equipment
Load/Unload Lock Chambers with Load/Unload Magazines
- Stainless steel chamber
- Hydrocarbon-free high-vacuum pumping system
Pre-treatment Chamber
Evaporation Chamber
- Stainless steel chamber equipped with two evaporation process stations
- View port for process observation
- Hydrocarbon-free high-vacuum pumping system
- Shields to prevent crossover effects, shutter for covering of the evaporators
- Graphite heated jet evaporator JEC10
- Transverse EB evaporator 4-pocket swivel pan EV M-8
- Thin film deposition controller
- Gas supply and inlet system
