Key components  

Sputtering 

Rotatable sputter source, tubular
RDM750
Operation mode: DC, RF, DC-Pulsed 
Target dimensions: 2 target tubes; 750 mm x 160 mm diameter
Sputtering power: 20 kW
Substrate dimensions: 450 mm
Integration conditions/design: built-on source, rotatable dual; anode-free

Wide range sputter source, rectangular source
WSM900
Operation source: DC, RF, DC pulsed 
Target dimensions: 900 mm x 240 mm
Sputtering power: 12 kW
Substrate dimensions: 60 mm 
Integration conditions/design: built-on source, standard wide single

Double sputter source, rectangular design
SDM400 ... 900
Operation mode: LF, DC pulsed 
Target dimensions: 2 targets 400 - 900 mm x 100 mm
Sputtering power: 12 - 25 kW
Substrate dimensions: 200 mm - 600 mm
Integration conditions/design:  DN 40 ISO-KF; built-in source

Sputter source, rectangular design
SSM400 ... 900
Operation mode: DC, RF, DC pulsed
Target dimensions: 400...900 mm x 100 mm
Sputtering power: 6 - 12 kW
Substrate dimensions: 200 mm - 600 mm 
Integration conditions/design: built-on source, standard single

Sputter source, triangular design
PPS-D320
Operation mode: DC, RF, DC pulsed 
Target dimensions: side length 320 mm
Sputtering power: 5 kW
Substrate dimensions: diameter 8,0 inches
Integration conditions/design: built-on source

Small area sputter sources, round design - PPS series

PPS-50
Operating mode: DC, LF, RF, DC pulsed 
Target diameter: 50 mm
Sputtering power: 0,5 kW
Substrate dimensions: diameter 1,5 inches
Integration conditions/design:  DN 40 ISO-KF; built-in source

PPS-100
Operating mode: DC, LF, RF, DC pulsed 
Target diameter: 100 mm
Sputtering power: 1,5 kW
Substrate dimensions: diameter 2,5 inches
Integration conditions/design: DN 40 ISO-KF; built-in source

PPS-150
Operating mode: DC, LF, RF, DC pulsed
Target diameter: 150 mm
Sputtering power: 3,0 kW
Substrate dimensions: diameter 3,0 inches
Integration conditions/design: DN 40 ISO-KF; built-in source

PPS-A100
Operating mode: DC, LF, RF, DC pulsed 
Target diameter: 100 mm
Sputtering power: 1,5 kW
Substrate dimensions: diameter 2,5 inches
Integration conditions/design: DN 125 ISO-F; built-on source; focal setting possible

PPS-A150
Operation mode: DC, LF, RF, DC pulsed
Target diameter: 150 mm
Sputtering power: 3,0 kW
Substrate dimensions: diameter 2,5 inches
Integration conditions/design: DN 200 ISO-F; built-on source

PPS-A200
Operation mode: DC, LF, RF, DC pulse 
Target diameter: 200 mm
Sputtering power: 4,0 kW
Substrate dimensions: diameter 5,0 inches
Integration conditions/design: DN 250 ISO-F; built-on source

PPS-A250
Operation mode: DC, LF, RF, DC pulsed 
Target diameter: 250 mm
Sputtering power: 5,0 kW
Substrate dimensions: diameter 6,0 inches
Integration conditions/design: DN 320 ISO-F; built-on source

Rotatable planar sputter source, round design
PPS-AR250
Operation mode: DC, RF 
Target diameter: 250 mm
Sputtering dimensions: 5,0 kW
Substrate dimensions: diameter 6,0 ... 8,0 inches
Integration conditions/design: DN 400 ISO-KF; built-on source

Double ring planar sputter source, round design
PPS-DR220
Operation mode: DC, DC pulsed 
Target diameter: exterior 220 mm x 125 mm, interior 120 mm 
Sputtering power: 10 kW
Substrate dimensions: diameter 7,0 inches
Integration conditions/design: built-on source

Double ring planar sputter sources, round design
FE-DRM400
Operation mode: DC, DC pulsed 
Target dimensions: exterior 300 mm x 200 mm, interior 130 mm x 60 mm
Sputtering power: 12 kW
Substrate dimensions: diameter 8,0 inches
Integreation conditions/design: built-on source

The operation mode applies to all metals and metal oxides. The sputtering power has to be determined according to the target material.
Substrate dimensions are a recommendation; bleed-off of the deposition rate is taken into account. The layer homogeneity depends on processes, distances and substrate dimensions.