LOAD-LOCK SYSTEMs

LS400C ALD-MOCVD System for Oxides

• Load lock system for fuel cells
• Entry/exit lock chamber, process chamber
• CVD, PECVD, ALD
• (100 x 100) mm², Ø 6"

Application

• CVD, PECVD or ALD of ZrO, TiO and Al₂O₃  using organometallic precursors for fuel cells
• Processing of substrates (100 x 100) mm² or Ø 6“, 1-4 mm thick, ≤ 1000 g, substrate face-up processing mode
• R&D

Technology

• Substrate front-side heating in the load lock chamber up to 130 ^oC
• Substrate back-side heating in the process chamber, electrode surface temperature up to 550 ^oC

Deposition

• CVD
• PECVD
• ALD (Atomic Layer Deposition)

Equipment

Entry/Exit Load Lock Chamber

• Stainless steel chamber
• Hydrocarbon-free vacuum pumping system
• Linear substrate transfer system
• Radiation substrate heater with Pyrometer

CVD Chamber

• HF electrode with shower head and heater
• Substrate carrier with heater and lift system
• 13-line gas supply system with gas box, 4 liquid precursor supply systems, ALD valves, pipe jacket heater, inert atmosphere control of liquid precursors