VISS300S Sputter System (2) for TCO & Metals
- Inline system for transparent conductive oxides (TCO) and metals
- 2 load lock chambers, 2 process chambers (right side), dual rotable sputter sources (left)
- pre-treatment by sputter etching, sputtering
- substrate dimensions (300 x 300) mm²
application
- Sputtering of ZnO and ZnO:Al for TCO of thin film solar cells with ZnAl, ZnO:Al2O3 targets
- Processing of glass substrates on a carrier, substrate size 300 mm x 300 mm, thickness up to 5 mm, carrier tilt position of 7o to the vertical
- R&D, pilot production
technology
Substrate Pre-treatment
- HF sputter etching using an ion source, substrate heating
Deposition
- HF/DC magnetron sputtering and bipolar LF sputtering via dual magnetron sputter source, process control with plasma emission monitor; metal and metal oxide targets
- Dynamic deposion rate 8.25 nm·m/min·kW, resistivity ≥ 3.8·10-4 Ω·cm (tubular target sputtering ZnO: Al2O3)
- Base pressure ≤ 5 ⋅10-7 mbar
Equipment
Load/unload Lock Chambers
- Stainless steel chamber
- Hydrocarbon-free high-vacuum pumping system
Sputter Chamber
- Stainless steel chamber with two processing stations, heaters and overrun sections rectangular Standard Single Sputter Sources SDM750, SSM750RF, SSM750DC; Plasma Emission Monitor PEM® 05
Rotable Dual Magnetron Sputter and Pre-treatment Chamber
