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R&D+pilot systems - vertical Inline Systems

  • VISS300S Sputter System for TCO
  • VISS300S Sputter System for TCO and Metals
  • VISS400P PECVD System
  • VISS600S Sputter System
  • VISS600S für Metalloxide
Overview
Vertical Inline
Horizontal Inline
Cluster
Load-Lock
Batch
Key Components
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VISS300S sputter System (1) for TCO

  • Single/inline system for transparent conductive oxides (TCO)
  • Load lock chamber, process chamber with 2 sputter stations
  • substrate dimensions (300 x 300) mm²

Application

  • sputtering of ZnO or ZnO:Al as TCO for thin-film solar cells by means of ZnAl, ZnO:Al2O3 targets
  • coating of glass substrates on carriers; substrate dimensions 300 mm x 300 mm, thickness of up to 5 mm,
    carrier tilt position of 7o
  • R&D, pilot production

technology  

Deposition 

  • HF (13.56 MHz) and DC magnetron sputtering, plasma emission monitor control; metal oxide targets

equipment

Load/unload Lock Chamber

  • stainless steel chamber 
  • hydrocarbon free high-vacuum pumping system

Sputter Chamber

  • Stainless steel chamber with two processing stations,  heaters and overrun sections
  • Two rectangular Standard Single Magnetrons SSM750RF/SSM750DC
  • Hydrocarbon free high-vacuum pumping system
  • Plasma Emission Monitor PEM® 05, oxygen sensor
  • Substrate heater
  • Gas supply and inlet system
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          • VISS600S für Metalloxide
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        • History
          • Introduction
          • Electron Beam Technologies
          • 1928-1945: Laboratory for Electron Physics
          • Plasma Physics Technologies
          • 1945-1955: Institute for Industrial Isotope Separation
          • Vacuum Coating
          • 1955-1990: Manfred von Ardenne Research Institute
          • Biomedicine
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          • Company History Milestones
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          • Introduction
          • 1955-1990: New Home in Dresden
          • 1907: Birth and Family Background
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          • 1928-1945: Berlin Years
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          • 1945-1955: The Research Institute near Sukhumi
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          • OLEDs - The Surface Light
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